Aluminum Copper Clad Laminate

Aluminum Copper Clad Laminate Aluminum Copper Clad Laminate Suppliers Copper Clad Aluminum Copper Clad Aluminum Manufacturer Copper Clad Aluminum Sheets
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DK Enterprise is a leading Aluminum Copper Clad Laminate Supplier located in Ahmedabad, Gujarat manufacturing and merchandizing in high-quality Aluminum Copper Clad Laminate Sheets and panels for 10+ years now. Our wide range of products is quite acknowledged by our clients for their excellent electrical insulating properties, adhesion, and heat resistance.Our Aluminum-backed PCBs can constantly enhance durability and longstanding reliability of a final product via temperature control and related decreases in failure rates. Moreover, the aluminum designs also deliver better mechanical solidity and lower thermal expansion levels compared to any other available materials.

The end-to-end product range that we supply is derived from reputed vendors across the globe. By leveraging cutting edge technologies, best-grade of factor inputs, and strict quality inspection we deliver products that meet international quality standards.

How Is Aluminum Copper Clad Laminate Made?

The aluminum bar is totally melted into an aluminum liquid and put into a furnace for standing. After filtering aluminum liquid, it penetrates the composite zone where the copper sheets are directly placed to let it touch the surface of aluminum liquid for bonding. Our Aluminum copper clad laminate sheets are manufactured as per the IPC standard and following an advanced process to deliver improved product quality at reduced costs.

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Some Of The Applications Of Aluminum Copper Clad Laminate

  • High power LED
  • Car headlights
  • Home appliances
  • LCD TV and soundbox
  • Modifier and sparker for motorcycle and mobile devices
  • Advanced electronic products
  • High-density circuit board
  • Three-dimensional space circuit assembly
  • Circuits and the shell integration assembly
  • Electromagnetic shielding and more

Features Of Aluminum Copper Clad Laminate

  • Excellent flame retardant
  • Good heat resistance
  • Excellent in thermal conductivity
  • Good electromagnetic shielding and solder float
  • High mechanical strength
  • Very light in weight
  • Top-notch machining properties
  • Quite cost-effective

Product Specification

Specification
Thickness 0.8, 1.0, 1.2, 1.5, 1.6, 2.0, 3.0 mm
Copper thickness 18/0;25/0;28/0; 35/0; 70/0 ; 105/0 μm, based on customers’
Dielectric layer 80μm, 100μm, 120μm, 150μm
Size 1000×1200,1030x1230,1050x1250 mm, based on customers’
Item No. Item Test conditions Unit LWAF02- 1.0 LWAF02- 1.5 LWAF02- 2.0 LWAF02- 2.5 LWAF02- 3.0
 TC=1.0 TC=1.5 TC =2.0 TC=2.5 TC =3.0
Value Value  Value  Value Value
1 Thermal stress (288℃) Float
IPC-TM-650 2.4.13.1		 sec 180 560 450 420 400
2 Thermal conductivity

A

ASTM5470

 W/m.K 1.08 1.54 2.12 2.61 3.05
3 Peel  Strength ≥        A
Float288℃ /10 Sec
IPC-TM-650 2.4.8		 LBS/IN ≥9 ≥9 ≥9 ≥9 ≥9
4 Water absorption D24/23
IPC-TM-650 2.6.2.1		 % ≤0.6 ≤0.65 ≤0.72 ≤0.74 ≤0.78
5 Glass Transition E2/105    DSC
IPC-TM-650 2.4.25		 ℃ 120 130 130 120 110
6 Flammability IPC-TM-650 2.3.9 94V-0 Pass Pass Pass Pass Pass
7

Surface  Resistivity

 E24/125
IPC-TM-650 2.5.17.1		   MΩ 3.8×105 5.2×105 5.9×105 5.3×105 4.8×105
8 Volume  Resistivity            E24/125
IPC-TM-650 2.5.17.1		 MΩ•cm 4.8×106 6.8×106 6.5×106 5.4×106 5.0×106
9 Breakdown voltage D48/50+D0.5/23
IPC-TM-650 2.5.6		 KV (ac) ≥3 ≥3 ≥3 ≥3 ≥3
10 Dielectric Constant C40/23/50
IPC-TM-650 2.5.5.2		 1MHz Max 1.84 1.84 1.84 1.84 1.84
11 CTI UL746E DSR V ≥600 ≥600 ≥600 ≥600 ≥600
12 Chemical resistance CPCA4105-2010 　 No change in appearance, no blistering, no stratification
13 After punching thermal shock CPCA4105-2010 　 No blistering, no stratification

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Product Application

Application fields
  • Used for making high power LED, car headlights, LCD TV, advanced electronic products, large current, high density and power consumption circuit board, excellent heat dissipation.
  • The implementing circuit assembly of high reliability, long life.
  • Used to make circuits and the shell integration assembly, realizing the short circuit assembly of small, light, thin.
  • Used to make three dimensional space circuit assembly, the thin board has can bend and deformation.
  • Used to make electromagnetic shielding the circuit in the assembly.
  • Used to make need high resistance to thermal shock circuit assembly.
  • Other new circuit assembly.

Product packaging

Let’s Get In Touch!

If you in search of a top-notch XPC Copper Clad Laminate Suppliers in Ahmedabad, Gujarat for your upcoming project, then please feel free to get in touch with DK Enterprise on (+91 98250 15438) or mail us at midaslaminate@yahoo.com

ADDRESS:

A-116, Tirthraj Complex, Opp. V.S Hospital
Beside Hasubhai Chambers, Ellisbridge,
Ahmedabad - 380006, Gujarat (India)

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